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Welcome to ChinaCom 2007

All the notifications have been sent out. The application for Student Participation and Travel Grants is open, please visit http://www.chinacom.org/include/Call For Participations_ChinaCom2007.pdf for details

The conference is partially supported by “the SJTU Funding for International Conferences”,会议得到上海交通大学"国际会议专项资助基金"的资助. Chinacom2007-Hotel Guidance for foreign participants

Conference

International Conference on Communications and Networking in China



Intro

The aim of CHINACOM is to bring together Chinese and International players in networking and communications under one roof, building a showcase in communications and networking research in China. Following the big success of the first of its series (i.e., CHINACOM 2006), CHINACOM will be held in Shanghai, one of the biggest metropolises in the world.
CHINACOM is being positioned as the premier international annual conference for the presentation of original and fundamental research advances in the field of Communications, Networks, and Internet Applications. The conference will consist of Technical Symposia and Workshops.

Address of the Conference:


Shanghai, China.

Student travel grants:


Applications are invited from qualified graduate students. Up to 10 awards are expected.

Sponsors:

Co-Sponsored by:

http://www.create-net.org/ http://www.icst.org

Technical-Sponsored by:

http://www.sjtu.edu.cn http://www.bupt.edu.cn http://www.zju.edu.cn http://www.ieee.org http://www.ieee-cas.org http://www.ewh.ieee.org/r10/beijing/vts/ http://mtt.org/index.html

 


All ACCEPTED and PRESENTED papers will be made available in IEEExplore Digital Library and then be indexed by Engineering Information (EI). Selected papers from CHINACOM2007 will be considered for Computer Networksand Ad Hoc Networks.Relevant papers will also be considered for a special issue on Advanced in Wireless Mesh Networks, ACM/Springer Mobile Networks and Applications (MONET) and a special issue on Communication and Information Security of China Communications Journal.
IEEE Catalog Number: 07EX1693C
ISBN: 1-4244-1009-6
Library of Congress: 2007920882